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145
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DSD
2009
IEEE
16 years 1 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
199
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SIBGRAPI
2008
IEEE
16 years 1 months ago
2008
IEEE
This paper presents a 3D face photography system based on a small set of training facial range images. The training set is composed by 2D texture and 3D range images (i.e. geometr...
172
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MICRO
2007
IEEE
16 years 1 months ago
2007
IEEE
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
162
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ITCC
2005
IEEE
16 years 9 days ago
2005
IEEE
Recently, a lot of effort has been done to investigate all kinds of explicit formulae for speeding up group operation of hyperelliptic curve cryptosystem (HECC). In this paper, ex...
190
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WACV
2005
IEEE
16 years 8 days ago
2005
IEEE
Current two-dimensional image based face recognition systems encounter difficulties with large facial appearance variations due to the pose, illumination and expression changes. ...