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ISPD
2011
ACM
253views Hardware» more  ISPD 2011»
14 years 9 months ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig
ISMAR
2003
IEEE
15 years 12 months ago
Telepresence System Using High-Resolution Omnidirectional Movies and a Reactive Display
This paper describes a novel telepresence system that uses high-resolution movies and a reactive display system with a treadmill. In this system, users can walk through a virtuali...
Sei Ikeda, Tomokazu Sato, Masayuki Kanbara, Naokaz...
CVPR
2009
IEEE
1524views Computer Vision» more  CVPR 2009»
17 years 1 months ago
3D Pose Estimation and Segmentation using Specular Cues
We present a system for fast model-based segmentation and 3D pose estimation of specular objects using appearance based specular features. We use observed (a) specular reflection...
Ju Yong Chang, Ramesh Raskar, Amit K. Agrawal
ICCV
2007
IEEE
16 years 8 months ago
A systematic approach for 2D-image to 3D-range registration in urban environments
The photorealistic modeling of large-scale objects, such as urban scenes, requires the combination of range sensing technology and digital photography. In this paper, we attack th...
Lingyun Liu, Ioannis Stamos
ICCV
2003
IEEE
16 years 8 months ago
Fast Intensity-based 2D-3D Image Registration of Clinical Data Using Light Fields
Registration of a preoperative CT (3D) image to one or more X-ray projection (2D) images, a special case of the pose estimation problem, has been attempted in a variety of ways wi...
Daniel B. Russakoff, Torsten Rohlfing, Calvin R. M...