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VTC
2006
IEEE
203views Communications» more  VTC 2006»
16 years 21 days ago
The 3G Long-Term Evolution - Radio Interface Concepts and Performance Evaluation
Abstract—3GPP is in the process of defining the long-term evolution (LTE) for 3G radio access, sometimes referred to as Super3G, in order to maintain the future competitiveness o...
Erik Dahlman, Hannes Ekström, Anders Furuskar...
181
Voted
CVPR
2010
IEEE
16 years 1 days ago
Efficient Joint 2D and 3D Palmprint Matching with Alignment Refinement
Palmprint verification is a relatively new but promising personal authentication technique for its high accuracy and fast matching speed. Two dimensional (2D) palmprint recognitio...
Wei Li, Lei Zhang, david Zhang, Guangming Lu, Jing...
FPL
2009
Springer
107views Hardware» more  FPL 2009»
15 years 11 months ago
An FPGA based verification platform for HyperTransport 3.x
In this paper we present a verification platform designed for HyperTransport 3.x (HT3) applications. HyperTransport 3.x is a very low latency and high bandwidth chip-tochip interc...
Heiner Litz, Holger Fröning, Maximilian Th&uu...
ECCV
2008
Springer
16 years 8 months ago
Simultaneous Detection and Registration for Ileo-Cecal Valve Detection in 3D CT Colonography
Object detection and recognition has achieved a significant progress in recent years. However robust 3D object detection and segmentation in noisy 3D data volumes remains a challen...
Le Lu, Adrian Barbu, Matthias Wolf, Jianming Liang...
MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
16 years 21 days ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...