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ICC
2009
IEEE
184views Communications» more  ICC 2009»
16 years 1 months ago
A 3-D Markov Chain Queueing Model of IEEE 802.11 DCF with Finite Buffer and Load
—We introduce a 3-dimensional Markov chain that integrates the IEEE 802.11 DCF contention resolution and queueing processes into one model. Important QoS measures, delay and loss...
Ren Ping Liu, Gordon Sutton, Iain B. Collings
CISIM
2008
IEEE
16 years 1 months ago
Tensor Decomposition for 3D Bars Problem
In this paper, we compare performance of several dimension reduction techniques, namely SVD, NMF and SDD.The qualitative comparison is evaluated on a collection of bars. We compare...
Jan Platos, Jana Kocibova, Pavel Krömer, Pave...
SAMT
2007
Springer
98views Multimedia» more  SAMT 2007»
16 years 21 days ago
Semantic Annotation of 3D Surface Meshes Based on Feature Characterization
In this paper we describe the main aspects of a system to perform non-trivial segmentations of 3D surface meshes and to annotate the detected parts through concepts expressed by an...
Marco Attene, Francesco Robbiano, Michela Spagnuol...
ICIP
2005
IEEE
16 years 6 days ago
Accuracy estimation of a new omnidirectional 3D vision sensor
We present a computer vision system that associates omnidirectional vision with structured light with the aim of obtaining depth information for a 360 degrees field of view.The a...
Radu Orghidan, Joaquim Salvi, El Mustapha Mouaddib
ICRA
2003
IEEE
151views Robotics» more  ICRA 2003»
15 years 12 months ago
Microassembly of 3-D MEMS structures utilizing a MEMS microgripper with a robotic manipulator
This paper describes the process of bonding a MEMS (Micro-ElectroMechanical System) microgripper to the distal end of a robotic manipulator arm using a molten solder bonding techn...
Nikolai Dechev, William L. Cleghorn, James K. Mill...