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164
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
165
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
207
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NANONET
2009
Springer
15 years 11 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
150
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VRML
2006
ACM
16 years 16 days ago
2006
ACM
One of the most serious issues holding back the widespread of 3D contents on Internet has been their inaccessibility due to large data volume. Many compression and progressive tra...
182
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DAC
2004
ACM
16 years 7 months ago
2004
ACM
Capacitance extraction is an important problem that has been extensively studied. This paper presents a significant improvement for the fast multipole accelerated boundary element...