Many architectural scenes contain symmetric or repeated structures, which can generate erroneous image correspondences during structure from motion (Sfm) computation. Prior work h...
Andrea Cohen, Christopher Zach, Sudipta N. Sinha, ...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
In this work we address the problem of managing interconnect timing in high-level synthesis by generating a layoutfriendly microarchitecture. A metric called spreading score is pr...
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Loop pipelining is a critical transformation in behavioral synthesis. It is crucial to producing hardware designs with acceptable latency and throughput. However, it is a complex ...