In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
We study algorithmic problems in multi-stage open shop processing systems that are centered around reachability and deadlock detection questions. We characterize safe and unsafe s...
Christian Eggermont, Alexander Schrijver, Gerhard ...
Abstract. We consider two standard notions in formal security protocol analysis: message deducibility and static equivalence under equational theories. We present polynomial-time a...
It is great practical interest to decide when to stop testing a software system in development phase and transfer it to the user. This problem is called as the optimal software re...
We consider the problem of scheduling a maximum profit selection of equal length jobs on m identical machines. Jobs arrive online over time and the goal is to determine a non-pre...
Sven Oliver Krumke, Alfred Taudes, Stephan Westpha...