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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
15 years 4 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
CORR
2011
Springer
189views Education» more  CORR 2011»
15 years 1 months ago
Analysis of multi-stage open shop processing systems
We study algorithmic problems in multi-stage open shop processing systems that are centered around reachability and deadlock detection questions. We characterize safe and unsafe s...
Christian Eggermont, Alexander Schrijver, Gerhard ...
IFIP
2010
Springer
15 years 1 months ago
Efficient Decision Procedures for Message Deducibility and Static Equivalence
Abstract. We consider two standard notions in formal security protocol analysis: message deducibility and static equivalence under equational theories. We present polynomial-time a...
Bruno Conchinha, David A. Basin, Carlos Caleiro
IJACTAICIT
2010
151views more  IJACTAICIT 2010»
15 years 1 months ago
The Comparative Study of Software Optimal Release Time Based on Burr Distribution
It is great practical interest to decide when to stop testing a software system in development phase and transfer it to the user. This problem is called as the optimal software re...
Hee-Cheul Kim, Hyoung-Keun Park
COR
2011
15 years 26 days ago
Online scheduling of weighted equal-length jobs with hard deadlines on parallel machines
We consider the problem of scheduling a maximum profit selection of equal length jobs on m identical machines. Jobs arrive online over time and the goal is to determine a non-pre...
Sven Oliver Krumke, Alfred Taudes, Stephan Westpha...