As VLSI technology scales toward 65nm and beyond, both timing and power performance of integrated circuits are increasingly affected by process variations. In practice, people oft...
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Simulation and verification using electronic design automation (EDA) tools are key steps in the design process for communication and signal processing systems. The synchronous dat...
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
When enacting a web service orchestration defined using the Business Process Execution Language (BPEL) we observed various safety property violations. This surprised us considerab...
David S. Rosenblum, Howard Foster, Jeff Kramer, Je...