As the level of chip integration continues to advance at a fast pace, the desire for efficient interconnects-whether on-chip or off-chip--is rapidly increasing. Traditional interc...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
A variety of factors is making it increasingly difficult and expensive to design and manufacture traditional Application Specific Integrated Circuits (ASICs). This has started a s...
This research focuses on the topic of interactive surfaces, especially those which embody kinetic interactions. Through the research, I will provide a definition and a theoretical...
Serendipity has a long tradition in the history of science as having played a key role in many significant discoveries. Computer scientists, valuing the role of serendipity in dis...