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ASIACRYPT
2003
Springer
16 years 2 days ago
Accumulating Composites and Improved Group Signing
Constructing practical and provably secure group signature schemes has been a very active research topic in recent years. A group signature can be viewed as a digital signature wit...
Gene Tsudik, Shouhuai Xu
ICSE
2003
IEEE-ACM
16 years 1 days ago
An Analysis of the Fault Correction Process in a Large-Scale SDL Production Model
Improvements in the software development process depend on our ability to collect and analyze data drawn from various phases of the development life cycle. Our design metrics rese...
Dolores M. Zage, Wayne M. Zage
DATE
2010
IEEE
162views Hardware» more  DATE 2010»
15 years 12 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
HASE
2002
IEEE
15 years 11 months ago
An Approach to Specify and Test Component-Based Dependable Software
Components (in-house or pre-fabricated) are increasingly being used to reduce the cost of software development. Given that these components may not have not been developed with de...
Arshad Jhumka, Martin Hiller, Neeraj Suri
ICPADS
2002
IEEE
15 years 11 months ago
Experiences in Building a Scalable Distributed Network Emulation System
Network emulation systems are widely used to explore the behavior of network protocols and to test and evaluate protocol implementations and applications. The major problem of net...
Pei Zheng, Lionel M. Ni