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DATE
2009
IEEE
161views Hardware» more  DATE 2009»
16 years 1 months ago
Co-design of signal, power, and thermal distribution networks for 3D ICs
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
INFOCOM
2007
IEEE
16 years 26 days ago
Analysis of A Loss-Resilient Proactive Data Transmission Protocol in Wireless Sensor Networks
Abstract— Many of sensor network applications require reliable data communication such that data packets can be delivered to the destination without loss. However, existing relia...
Yingqi Xu, Wang-Chien Lee, Jianliang Xu
NSDI
2010
15 years 8 months ago
Exploring Link Correlation for Efficient Flooding in Wireless Sensor Networks
Existing flooding algorithms have demonstrated their effectiveness in achieving communication efficiency and reliability in wireless sensor networks. However, further performance ...
Ting Zhu, Ziguo Zhong, Tian He, Zhi-Li Zhang
CLOUDCOM
2010
Springer
15 years 4 months ago
REMEM: REmote MEMory as Checkpointing Storage
Checkpointing is a widely used mechanism for supporting fault tolerance, but notorious in its high-cost disk access. The idea of memory-based checkpointing has been extensively stu...
Hui Jin, Xian-He Sun, Yong Chen, Tao Ke
CODES
2011
IEEE
14 years 6 months ago
Memory controllers for high-performance and real-time MPSoCs: requirements, architectures, and future trends
Designing memory controllers for complex real-time and highperformance multi-processor systems-on-chip is challenging, since sufficient capacity and (real-time) performance must b...
Benny Akesson, Po-Chun Huang, Fabien Clermidy, Den...