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ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
16 years 3 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
CVPR
2010
IEEE
16 years 2 months ago
Personalization of Image Enhancement
We address the problem of incorporating user preference in automatic image enhancement. Unlike generic tools for automatically enhancing images, we seek to develop methods that ca...
Sing Bing Kang, Ashish Kapoor, Dani Lischinski
SAC
2009
ACM
16 years 1 months ago
An implementation substrate for languages composing modularized crosscutting concerns
We present the implementation of several programming languages with support for multi-dimensional separation of concerns (MDSOC) on top of a common delegation-based substrate, whi...
Hans Schippers, Michael Haupt, Robert Hirschfeld
ADMA
2009
Springer
246views Data Mining» more  ADMA 2009»
16 years 1 months ago
Semi Supervised Image Spam Hunter: A Regularized Discriminant EM Approach
Image spam is a new trend in the family of email spams. The new image spams employ a variety of image processing technologies to create random noises. In this paper, we propose a s...
Yan Gao, Ming Yang, Alok N. Choudhary
AIED
2009
Springer
16 years 1 months ago
Identifying strategies in user's exploratory learning behaviour for mathematical generalisation
Abstract. The nature of the activities that take place in Exploratory Learning Environments allow generating a variety of learner trajectories and makes difficult to develop a mod...
Mihaela Cocea, George D. Magoulas