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168
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VTS
2002
IEEE
15 years 11 months ago
2002
IEEE
The testing time for a system-on-chip (SOC) is determined to a large extent by the design of test wrappers and the test access mechanism (TAM). Wrapper/TAM co-optimization is ther...
205
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TCAD
2011
15 years 1 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
200
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ICST
2010
IEEE
15 years 5 months ago
2010
IEEE
—When a program is modified during software evolution, developers typically run the new version of the program against its existing test suite to validate that the changes made ...
195
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ISQED
2006
IEEE
16 years 22 days ago
2006
IEEE
— With advanced VLSI manufacturing technology in deep submicron (DSM) regime, we can integrate entire electronic systems on a single chip (SoC). Due to the complexity in SoC desi...
164
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CHI
2010
ACM
16 years 1 months ago
2010
ACM
Testing a GUI’s visual behavior typically requires human testers to interact with the GUI and to observe whether the expected results of interaction are presented. This paper pr...