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DATE
2007
IEEE
86views Hardware» more  DATE 2007»
16 years 28 days ago
Thermally robust clocking schemes for 3D integrated circuits
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Ta...
ESCIENCE
2007
IEEE
16 years 28 days ago
Cross-Middleware Interoperability in Distributed Concurrent Engineering
Secure, distributed collaboration between different organizations is a key challenge in Grid computing today. The GDCD project has produced a Grid-based demonstrator Virtual Colla...
E. Rowland Watkins, Mark McArdle, Thomas Leonard, ...
HICSS
2007
IEEE
110views Biometrics» more  HICSS 2007»
16 years 28 days ago
The Future of Work: What Does Online Community Have to Do with It?
Amidst constant innovation in information and communication technologies, a new pattern of work is emerging. Hierarchical authority structures are giving way to greater decision-m...
Dejin Zhao, Mary Beth Rosson, Sandeep Purao
IAT
2007
IEEE
16 years 28 days ago
A Design of Client Side Information Management Method for Web Services Collaboration
In this paper, we propose a client side information management method for web services collaboration. Recently, personalization is one of the most challenging topics of the web te...
Hajime Hotta, Takashi Nozawa, Masafumi Hagiwara
ICAT
2007
IEEE
16 years 28 days ago
Exploiting Virtual Objects' Attributes and Avatar's Behavior in DVEs Partitioning
Partitioning constitutes one of the most critical challenges a distributed virtual environment needs to handle and is related to the efficient assignment of the existing entities ...
Christos Bouras, Eri Giannaka, Thrasyvoulos Tsiats...