—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
The rapid adoption of XML as the standard for data representation and exchange foreshadows a massive increase in the amounts of XML data collected, maintained, and queried over th...
Neoklis Polyzotis, Minos N. Garofalakis, Yannis E....
Abstract—Recently, mashups are gaining tremendous popularity as an important Web 2.0 application. Mashups provide end-users with an opportunity to create personalized Web service...
Osama Al-Haj Hassan, Lakshmish Ramaswamy, John A. ...
The seamless communication of data and voice over short-range, point-to-multipoint wireless links between mobile and/or stationary devices is becoming a reality by newly introduce...
Sachin Abhyankar, Rishi Toshniwal, Carlos de M. Co...
Abstract. In this paper we present a coarse-grained parallel algorithm, CONQUEST, for constructing boundederror summaries of high-dimensional binary attributed data in a distribute...