In this paper, we present a new approach to HMM adaptation that jointly compensates for additive and convolutive acoustic distortion in environment-robust speech recognition. The ...
Jinyu Li, Li Deng, Dong Yu, Yifan Gong, Alex Acero
—Multiuser orthogonal frequency division multiplexing (MU-OFDM) is a promising technique for future wide-area mobile communications, which can provide scalable high data rate tra...
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
A huge application domain, in particular, wireless and handheld devices strongly requires flexible and powerefficient hardware with high performance. This can only be achieved with...
Diandian Zhang, Anupam Chattopadhyay, David Kammle...
—Recent years have witnessed the deployments of wireless sensor networks for mission-critical applications such as battlefield monitoring and security surveillance. These applic...