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186
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ICCAD
2006
IEEE
16 years 4 months ago
2006
IEEE
We present a dynamic voltage scaling (DVS) technique that minimizes system-wide energy consumption for both periodic and sporadic tasks. It is known that a system consists of proc...
184
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ICCAD
2006
IEEE
16 years 4 months ago
2006
IEEE
As wireless LAN devices become more prevalent in the consumer electronics market, there is an ever increasing pressure to reduce their overall cost. The test cost of such devices ...
181
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ICCAD
2006
IEEE
16 years 4 months ago
2006
IEEE
Battery-powered wireless sensors are severely constrained by the amount of the available energy. A method for computing the energy budget per sensing task can be a valuable design...
171
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ICCAD
2005
IEEE
16 years 4 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
166
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ICCAD
2004
IEEE
16 years 4 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...