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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
16 years 3 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
DATE
2009
IEEE
121views Hardware» more  DATE 2009»
16 years 1 months ago
Remote measurement of local oscillator drifts in FlexRay networks
—Distributed systems, especially time-triggered ones, are implementing clock synchronization algorithms to provide and maintain a common view of time among the different nodes. S...
Eric Armengaud, Andreas Steininger
GLOBECOM
2009
IEEE
16 years 1 months ago
Development Framework for Implementing FPGA-Based Cognitive Network Nodes
—This paper identifies important features a cognitive radio framework should provide, namely a virtual architecture ware abstraction, an adaptive run-time system for managing co...
Jorg Lotze, Suhaib A. Fahmy, Juanjo Noguera, Baris...
ICDCS
2007
IEEE
16 years 28 days ago
Deploying Video-on-Demand Services on Cable Networks
— Efficient video-on-demand (VoD) is a highly desired service for media and telecom providers. VoD allows subscribers to view any item in a large media catalog nearly-instantane...
Matthew S. Allen, Ben Y. Zhao, Richard Wolski
ISQED
2007
IEEE
206views Hardware» more  ISQED 2007»
16 years 27 days ago
Provisioning On-Chip Networks under Buffered RC Interconnect Delay Variations
Abstract—A Network-on-Chip (NoC) replaces on-chip communication implemented by point-to-point interconnects in a multi-core environment by a set of shared interconnects connected...
Mosin Mondal, Tamer Ragheb, Xiang Wu, Adnan Aziz, ...