5744 search results - page 804 / 1149 » System level design, a VHDL based approach |
194
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ICCAD
2009
IEEE
15 years 4 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
209
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WOSP
2005
ACM
16 years 12 days ago
2005
ACM
In order to effectively validate the performance of software systems throughout their development cycle it is necessary to continuously build performance models from software mod...
156
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VLSID
2002
IEEE
16 years 7 months ago
2002
IEEE
Verification is one of the most complex and expensive tasks in the current Systems-on-Chip (SOC) design process. Many existing approaches employ a bottom-up approach to pipeline v...
231
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DAC
2004
ACM
15 years 10 months ago
2004
ACM
The ability to control the variations in IC fabrication process is rapidly diminishing as feature sizes continue towards the sub-100 nm regime. As a result, there is an increasing...
182
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MM
2005
ACM
16 years 12 days ago
2005
ACM
This paper describes an ambient intelligent prototype known as socio-ec(h)o. socio-ec(h)o explores the design and implementation of a system for sensing and display, user modeling...