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NOMS
2008
IEEE
123views Communications» more  NOMS 2008»
16 years 1 months ago
Model-based management of security services in complex network environments
Abstract—The security mechanisms employed in current networked environments are increasingly complex, and their configuration management has an important role for the protection...
João Porto de Albuquerque, Heiko Krumm, Pau...
ICCD
2005
IEEE
221views Hardware» more  ICCD 2005»
16 years 3 months ago
Broadband Impedance Matching for Inductive Interconnect in VLSI Packages
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
Brock J. LaMeres, Sunil P. Khatri
DATE
2010
IEEE
156views Hardware» more  DATE 2010»
15 years 12 months ago
3D-integration of silicon devices: A key technology for sophisticated products
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
Armin Klumpp, Peter Ramm, R. Wieland
ISCA
2010
IEEE
305views Hardware» more  ISCA 2010»
15 years 12 months ago
Rethinking DRAM design and organization for energy-constrained multi-cores
DRAM vendors have traditionally optimized the cost-perbit metric, often making design decisions that incur energy penalties. A prime example is the overfetch feature in DRAM, wher...
Aniruddha N. Udipi, Naveen Muralimanohar, Niladris...
ICCAD
2000
IEEE
109views Hardware» more  ICCAD 2000»
15 years 11 months ago
Latency-Guided On-Chip Bus Network Design
Abstract— Deep submicron technology scaling has two major ramifications on the design process. First, reduced feature size significantly increases wire delay, thus resulting in...
Milenko Drinic, Darko Kirovski, Seapahn Meguerdich...
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