Abstract—The security mechanisms employed in current networked environments are increasingly complex, and their configuration management has an important role for the protection...
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
DRAM vendors have traditionally optimized the cost-perbit metric, often making design decisions that incur energy penalties. A prime example is the overfetch feature in DRAM, wher...
Aniruddha N. Udipi, Naveen Muralimanohar, Niladris...
Abstract— Deep submicron technology scaling has two major ramifications on the design process. First, reduced feature size significantly increases wire delay, thus resulting in...