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ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
16 years 3 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
IUI
2009
ACM
16 years 3 months ago
Musicsim: integrating audio analysis and user feedback in an interactive music browsing ui
In music information retrieval (MIR), there are two main research directions, which are based either on a folder hierarchy and metadata, or on the actual acoustic content. We beli...
Ya-Xi Chen, Andreas Butz
CHI
2010
ACM
16 years 1 months ago
A strategy-centric approach to the design of end-user debugging tools
End-user programmers’ code is notoriously buggy. This problem is amplified by the increasing complexity of end users’ programs. To help end users catch errors early and reliab...
Valentina Grigoreanu, Margaret M. Burnett, George ...
CHI
2010
ACM
16 years 1 months ago
How does search behavior change as search becomes more difficult?
Search engines make it easy to check facts online, but finding some specific kinds of information sometimes proves to be difficult. We studied the behavioral signals that suggest ...
Anne Aula, Rehan M. Khan, Zhiwei Guan
SIGCSE
2010
ACM
232views Education» more  SIGCSE 2010»
16 years 1 months ago
Design and evaluation of a computer science and engineering course for middle school girls
A significant focus in the United States recently has been to increase engagement and interest in STEM curricula, particularly among girls and underrepresented minorities [3]. In ...
Gabriela Marcu, Samuel J. Kaufman, Jaihee Kate Lee...