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ASPDAC
2012
ACM
238views Hardware» more  ASPDAC 2012»
14 years 2 months ago
Design for manufacturability and reliability for TSV-based 3D ICs
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
CORR
2012
Springer
205views Education» more  CORR 2012»
14 years 2 months ago
Pricing Data: A Look at Past Proposals, Current Plans, and Future Trends
Traditionally, network operators have only used simple flat-rate unlimited data plans to vie for customers. But today, with the popularity of mobile devices and exponential growt...
Soumya Sen, Carlee Joe-Wong, Sangtae Ha, Mung Chia...
TCC
2012
Springer
226views Cryptology» more  TCC 2012»
14 years 2 months ago
Subspace LWE
The (decisional) learning with errors problem (LWE) asks to distinguish “noisy” inner products of a secret vector with random vectors from uniform. In recent years, the LWE pro...
Krzysztof Pietrzak
ICDE
2012
IEEE
197views Database» more  ICDE 2012»
13 years 9 months ago
GSLPI: A Cost-Based Query Progress Indicator
Abstract—Progress indicators for SQL queries were first published in 2004 with the simultaneous and independent proposals from Chaudhuri et al. and Luo et al. In this paper, we ...
Jiexing Li, Rimma V. Nehme, Jeffrey F. Naughton
CVPR
2012
IEEE
13 years 9 months ago
Bilevel sparse coding for coupled feature spaces
In this paper, we propose a bilevel sparse coding model for coupled feature spaces, where we aim to learn dictionaries for sparse modeling in both spaces while enforcing some desi...
Jianchao Yang, Zhaowen Wang, Zhe Lin, Xianbiao Shu...