—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Traditionally, network operators have only used simple flat-rate unlimited data plans to vie for customers. But today, with the popularity of mobile devices and exponential growt...
Soumya Sen, Carlee Joe-Wong, Sangtae Ha, Mung Chia...
The (decisional) learning with errors problem (LWE) asks to distinguish “noisy” inner products of a secret vector with random vectors from uniform. In recent years, the LWE pro...
Abstract—Progress indicators for SQL queries were first published in 2004 with the simultaneous and independent proposals from Chaudhuri et al. and Luo et al. In this paper, we ...
In this paper, we propose a bilevel sparse coding model for coupled feature spaces, where we aim to learn dictionaries for sparse modeling in both spaces while enforcing some desi...