— Performance comparison of multiuser OFDM-TDMA and OFDMA systems by considering physical and link cross-layer behavior is conducted in this work. We provide a new framework for ...
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
Jason Cong, Ashok Jagannathan, Yuchun Ma, Glenn Re...
The HCI community currently faces the problem of making tangible user interfaces actively responsive to their user’s current physical context. This paper explores the context of...
Simulation is a low cost alternative to experimentation on real-world physical systems. Grid technology enables coordinated use of and secure access to distributed computing resou...
Xinjun Chen, Wentong Cai, Stephen John Turner, Yon...
Running Data Grid applications such as High Energy Nuclear Physics (HENP) and weather modelling experiments involves working with huge data sets possibly of hundreds of Terabytes ...