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190
Voted
ICCD
2006
IEEE
16 years 4 months ago
2006
IEEE
— As silicon CMOS devices are scaled down into the nanoscale regime, new challenges at both the device and system level are arising. While some of these challenges will be overco...
242
Voted
AFRICACRYPT
2009
Springer
16 years 2 months ago
2009
Springer
We present the first simple power analysis (SPA) of software implementations of KeeLoq. Our attack drastically reduces the efforts required for a complete break of remote keyless...
205
Voted
ISORC
2009
IEEE
16 years 1 months ago
2009
IEEE
Distributed real-time automotive embedded systems have to be highly dependable as well as cost-efficient due to the large number of manufactured units. To close the gap between r...
219
Voted
SENSYS
2005
ACM
16 years 26 days ago
2005
ACM
Sensing technology is a cornerstone for many industrial applications. Manufacturing plants and engineering facilities, such as shipboard engine rooms, require sensors to ensure pr...
235
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NANONET
2009
Springer
15 years 12 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...