12032 search results - page 595 / 2407 » Simulation of Manufacturing Systems |
203
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ISPD
2005
ACM
16 years 24 days ago
2005
ACM
In the nanometer VLSI technology, the variation effects like manufacturing variation, power supply noise, temperature etc. become very significant. As one of the most vital nets...
226
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EVOW
2001
Springer
15 years 11 months ago
2001
Springer
The integrated circuits design flow is rapidly moving towards higher description levels. However, test-related activities are lacking behind this trend, mainly since effective faul...
217
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DAC
2006
ACM
15 years 9 months ago
2006
ACM
Software-based self-test (SBST) has recently emerged as an effective methodology for the manufacturing test of processors and other components in systems-on-chip (SoCs). By moving ...
202
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COMPUTING
2007
15 years 7 months ago
2007
Reverse engineering is concerned with the reconstruction of surfaces from three-dimensional point clouds originating from laser-scanned objects. We present an adaptive surface rec...
224
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TCAD
2011
15 years 2 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...