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WSC
2008
15 years 9 months ago
A flexible and scalable experimentation layer
Modeling and simulation frameworks for use in different application domains, throughout the complete development process, and in different hardware environments need to be highly ...
Jan Himmelspach, Roland Ewald, Adelinde M. Uhrmach...
ICCAD
2004
IEEE
147views Hardware» more  ICCAD 2004»
16 years 3 months ago
Interval-valued reduced order statistical interconnect modeling
9, IO]. However, unlike the case with static timing, it is not so easy We show how recent advances in the handling of correlated interval representations of range uncertainty can b...
James D. Ma, Rob A. Rutenbar
ICCAD
2002
IEEE
161views Hardware» more  ICCAD 2002»
16 years 3 months ago
Non-tree routing for reliability and yield improvement
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
Andrew B. Kahng, Bao Liu, Ion I. Mandoiu
ISPASS
2007
IEEE
16 years 1 months ago
Modeling and Characterizing Power Variability in Multicore Architectures
Parameter variation due to manufacturing error will be an unavoidable consequence of technology scaling in future generations. The impact of random variation in physical factors s...
Ke Meng, Frank Huebbers, Russ Joseph, Yehea I. Ism...
ASPDAC
2007
ACM
123views Hardware» more  ASPDAC 2007»
15 years 10 months ago
Coupling-aware Dummy Metal Insertion for Lithography
As integrated circuits manufacturing technology is advancing into 65nm and 45nm nodes, extensive resolution enhancement techniques (RETs) are needed to correctly manufacture a chip...
Liang Deng, Martin D. F. Wong, Kai-Yuan Chao, Hua ...