12032 search results - page 2004 / 2407 » Simulation of Manufacturing Systems |
106
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
158
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
Due to reduction in device feature size and supply voltage, the sensitivity to radiation induced transient faults (soft errors) of digital systems increases dramatically. Intensiv...
174
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
Abstract— Modern integrated radio systems require highly linear analog/RF circuits. Two-tone simulations are commonly used to study a circuit’s nonlinear behavior. Very often, ...
161
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DSD
2007
IEEE
16 years 1 months ago
2007
IEEE
The reduction of the cumbersome operations of multiplication, division, and powering to addition, subtraction and multiplication is what makes the Logarithmic Number System (LNS) ...
164
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ESCIENCE
2007
IEEE
16 years 1 months ago
2007
IEEE
BOINC, a middleware system for volunteer computing, allows hosts to be attached to multiple projects. Each host periodically requests jobs from project servers and executes the jo...