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ICRA
2002
IEEE
109views Robotics» more  ICRA 2002»
15 years 11 months ago
Digital Tactile Sensing Elements Communicating through Conductive Skin Layers
In this paper, we propose a tactile sensing element that communicates through two dimensional conductive skin layers without individual wires. Each tactile element has sensors and...
Mitsuhiro Hakozaki, Hiroyuki Shinoda
HPCA
2009
IEEE
16 years 7 months ago
Optimizing communication and capacity in a 3D stacked reconfigurable cache hierarchy
Cache hierarchies in future many-core processors are expected to grow in size and contribute a large fraction of overall processor power and performance. In this paper, we postula...
Niti Madan, Li Zhao, Naveen Muralimanohar, Anirudd...
HPCA
2003
IEEE
16 years 6 months ago
A Methodology for Designing Efficient On-Chip Interconnects on Well-Behaved Communication Patterns
As the level of chip integration continues to advance at a fast pace, the desire for efficient interconnects-whether on-chip or off-chip--is rapidly increasing. Traditional interc...
Wai Hong Ho, Timothy Mark Pinkston
HPCA
2002
IEEE
16 years 6 months ago
Improving Value Communication for Thread-Level Speculation
Thread-Level Speculation (TLS) allows us to automatically parallelize general-purpose programs by supporting parallel execution of threads that might not actually be independent. ...
J. Gregory Steffan, Christopher B. Colohan, Antoni...
CLUSTER
2009
IEEE
16 years 1 months ago
Overlapping computation and communication in SMT clusters with commodity interconnects
Abstract—In this paper we focus on optimizing the performance in a cluster of Simultaneous Multithreading (SMT) processors connected with a commodity interconnect (e.g. Gbit Ethe...
Georgios I. Goumas, Nikos Anastopoulos, Nectarios ...