9511 search results - page 1733 / 1903 » Selected Design Issues |
155
click to vote
ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
163
click to vote
ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...
178
click to vote
ICCAD
2002
IEEE
16 years 3 months ago
2002
IEEE
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
179
click to vote
SOSP
2005
ACM
16 years 3 months ago
2005
ACM
Energy consumption has become an important issue in high-end data centers, and disk arrays are one of the largest energy consumers within them. Although several attempts have been...
174
click to vote
IUI
2010
ACM
16 years 3 months ago
2010
ACM
Most of the previous work on non-invasive brain-computer interfaces (BCIs) has been focused on feature extraction and classification algorithms to achieve high performance for the...