5358 search results - page 733 / 1072 » Script-based Presentation of Simulation Results |
171
click to vote
ICCD
2001
IEEE
16 years 3 months ago
2001
IEEE
In this paper, we present a high-level power modeling technique to estimate the power consumption of reconfigurable devices such as complex programmable logic devices (CPLDs) and ...
167
click to vote
ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— In today’s complex SoC designs, verification and debugging are becoming ever more crucial and increasingly timeconsuming tasks. The prevalence of embedded memories adds to t...
164
click to vote
ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
152
click to vote
ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
Process variations cause different behavior of timingdependent effects across different chips. In this work, we analyze one example of timing-dependent effects, crosscoupling ...
148
click to vote
ICCAD
2002
IEEE
16 years 3 months ago
2002
IEEE
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...