3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
Jonathan Valamehr, Ted Huffmire, Cynthia E. Irvine...
Multiprocessor architectures that continuously execute atomic blocks (or chunks) of instructions can improve performance and software productivity. However, all of the prior propo...
Middleboxes are ubiquitous in today’s networks and perform a variety of important functions, including IDS, VPN, firewalling, and WAN optimization. These functions differ vastl...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...