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BIRTHDAY
2012
Springer
14 years 2 months ago
A Qualitative Security Analysis of a New Class of 3-D Integrated Crypto Co-processors
3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
Jonathan Valamehr, Ted Huffmire, Cynthia E. Irvine...
HPCA
2012
IEEE
14 years 2 months ago
BulkSMT: Designing SMT processors for atomic-block execution
Multiprocessor architectures that continuously execute atomic blocks (or chunks) of instructions can improve performance and software productivity. However, all of the prior propo...
Xuehai Qian, Benjamin Sahelices, Josep Torrellas
SIGCOMM
2012
ACM
13 years 9 months ago
Multi-resource fair queueing for packet processing
Middleboxes are ubiquitous in today’s networks and perform a variety of important functions, including IDS, VPN, firewalling, and WAN optimization. These functions differ vastl...
Ali Ghodsi, Vyas Sekar, Matei Zaharia, Ion Stoica
DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
DAC
2012
ACM
13 years 9 months ago
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Xin Zhao, Michael Scheuermann, Sung Kyu Lim
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