Large-scale process fluctuations (particularly random device mismatches) at nanoscale technologies bring about highdimensional strongly nonlinear performance variations that canno...
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Ta...
Process related variations are considered a major concern in emerging sub-65nm technologies. In this paper, we investigate the impact of process variations on different types of c...
— We present a field programmable gate array (FPGA) implementation of a turbo-like decoder for a serially concatenated pulse-position modulation (SCPPM) code. NASA developed thi...
Michael K. Cheng, Bruce E. Moision, Jon Hamkins, M...
Physical Design of modern systems on chip is extremely challenging. Such digital integrated circuits often contain tens of millions of logic gates, intellectual property blocks, e...
Aaron N. Ng, Igor L. Markov, Rajat Aggarwal, Venky...