Sensor networks have emerged as an interesting and important research area in the last few years. In order to construct a wireless sensor network, synchronization of base stations...
— Recently, researchers have discovered that many of social, natural and biological networks are characterized by scale-free power-law connectivity distribution and a few densely...
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
Power delivery is a growing reliability concern in microprocessors as the industry moves toward feature-rich, powerhungrier designs. To battle the ever-aggravating power consumpti...
Fayez Mohamood, Michael B. Healy, Sung Kyu Lim, Hs...
The advent of deep sub-micron technology has recently highlighted the criticality of the on-chip interconnects. As diminishing feature sizes have led to increases in global wiring...
Chrysostomos Nicopoulos, Dongkook Park, Jongman Ki...