1091 search results - page 96 / 219 » Requirements and design of a dynamic Grid networking layer |
184
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ASPDAC
2009
ACM
16 years 27 days ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
103
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DATE
2007
IEEE
16 years 21 days ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
196
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HCI
2007
15 years 7 months ago
2007
Automatic online analysis of meetings is very important from three points of view: serving as an important archive of a meeting, understanding human interaction processes, and prov...
156
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CONEXT
2005
ACM
15 years 8 months ago
2005
ACM
We present the design and implementation of the Janus1 architecture for providing flexible and lightweight access to sensor network resources from Internet-type networks. Janus p...
159
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SOCC
2008
IEEE
16 years 22 days ago
2008
IEEE
— A distributed on-chip decoupling capacitor network is proposed in this paper to replace one large capacitor. A system of distributed on-chip decoupling capacitors is shown to p...