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162
Voted
ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
190
Voted
IUI
2010
ACM
16 years 28 days ago
2010
ACM
Computer-based geometry systems have been widely used for teaching and learning, but largely based on mouse-andkeyboard interaction, these systems usually require users to draw fi...
186
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WISEC
2009
ACM
16 years 26 days ago
2009
ACM
In wireless sensor networks, it is critical to restrict the network access only to eligible sensor nodes, while messages from outsiders will not be forwarded in the networks. In t...
164
Voted
ATAL
2009
Springer
16 years 20 days ago
2009
Springer
We investigate and model the dynamics of two-dimensional stochastic self-assembly of intelligent micro-systems with minimal requirements in terms of sensing, actuation, and contro...
166
Voted
CASES
2009
ACM
16 years 18 days ago
2009
ACM
Networks of ultra-low-power nodes capable of sensing, computation, and wireless communication have applications in medicine, science, industrial automation, and security. Over the...