6568 search results - page 1016 / 1314 » Reducing the Complexity of Reductions |
161
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
151
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
162
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DSN
2009
IEEE
16 years 1 months ago
2009
IEEE
MAP queueing networks are recently proposed models for performance assessment of enterprise systems, such as multi-tier applications, where workloads are significantly affected b...
167
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GLOBECOM
2009
IEEE
16 years 1 months ago
2009
IEEE
—This paper proposes a new preprocessing scheme for rate-one quasi-orthogonal space-time block code (QO-STBC), which requires no channel state information at the transmitter. We ...
169
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HPDC
2009
IEEE
16 years 1 months ago
2009
IEEE
This paper presents the concept of pluggable parallelisation that allows scientists to develop “sequential like” codes that can take advantage of multi-core, cluster and grid ...