5762 search results - page 597 / 1153 » R-tree: A Hardware Implementation |
176
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ICCD
2004
IEEE
16 years 4 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
198
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ICCD
2004
IEEE
16 years 4 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
189
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ICCD
2002
IEEE
16 years 4 months ago
2002
IEEE
With technology advancing toward deep submicron, leakage energy is of increasing concern, especially for large onchip array structures such as caches and branch predictors. Recent...
180
Voted
ICCD
2001
IEEE
16 years 4 months ago
2001
IEEE
Classical floorplanning minimizes a linear combination of area and wirelength. When Simulated Annealing is used, e.g., with the Sequence Pair representation, the typical choice o...
148
Voted
ICCAD
2008
IEEE
16 years 4 months ago
2008
IEEE
This paper describes an efficient implementation of an effective sequential synthesis operation that uses induction to detect and merge sequentially-equivalent nodes. State-encodi...