The University of Pittsburgh's Computing Services and Systems Development organization is focused on the needs of the faculty and student population, totaling nearly 40,000 u...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
In this paper, we introduce a novel framework for clustering web data which is often heterogeneous in nature. As most existing methods often integrate heterogeneous data into a un...
The structure of problem-solving discourse in the expert advising setting can be modeled by adding a layer of metaplans to a plan-based model of the task domain. Classes of metapl...
Next generation industrial embedded platforms require the development of complex power and thermal management solutions. Indeed, an increasingly fine and intrusive thermal contro...
Andrea Acquaviva, Andrea Calimera, Alberto Macii, ...