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DAC
2011
ACM
14 years 6 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
FPGA
2006
ACM
224views FPGA» more  FPGA 2006»
15 years 10 months ago
Flexible implementation of genetic algorithms on FPGAs
In this paper, we propose a technique to flexibly implement genetic algorithms for various problems on FPGAs. For the purpose, we propose a basic architecture for GA which consist...
Tatsuhiro Tachibana, Yoshihiro Murata, Naoki Shiba...
FPL
2004
Springer
90views Hardware» more  FPL 2004»
16 years 4 days ago
Run-Time-Conscious Automatic Timing-Driven FPGA Layout Synthesis
Abstract. Layout tools for FPGAs can typically be run in two different modes: non-timing-driven and timing-driven. Non-timing-driven mode produces a solution quickly, without consi...
Jason Helge Anderson, Sudip Nag, Kamal Chaudhary, ...
ENTCS
2010
173views more  ENTCS 2010»
15 years 6 months ago
A Boolean Algebra of Contracts for Assume-guarantee Reasoning
Contract-based design is an expressive paradigm for a modular and compositional specification of programs. It is in turn becoming a fundamental concept in mainstream industrial co...
Yann Glouche, Paul Le Guernic, Jean-Pierre Talpin,...
ICRA
2003
IEEE
88views Robotics» more  ICRA 2003»
16 years 1 days ago
A new concept of modular parallel mechanism for machining applications
The subject of this paper is the design of a new concept of modular parallel mechanisms for three, four or five-axis machining applications. Most parallel mechanisms are designed ...
Damien Chablat, Philippe Wenger