3771 search results - page 375 / 755 » Process modeling for future technologies |
151
click to vote
ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
167
click to vote
ICIS
2003
15 years 8 months ago
2003
ThelinkagesbetweenISandbusinessunitsarerecognizedasbeingcriticaltoinformationsystemsdevelopment processes and outcomes. Previous research has found that they are associated with b...
165
click to vote
ECIR
2007
Springer
15 years 8 months ago
2007
Springer
The amount of data exponentially increases in information systems and it becomes more and more difficult to extract the most relevant information within a very short time. Among ot...
164
Voted
HT
2007
ACM
15 years 10 months ago
2007
ACM
Customers are driving down lead times for software, especially for Web applications, to only a few months. While a number of hypertext design models exist, they do not address the...
172
click to vote
OHS
2000
Springer
15 years 10 months ago
2000
Springer
Abstract. Structural computing is a new paradigm for developing applications in new domains. One of its benefits is that adaptation of behavior--as a consequence of changes of the ...