12943 search results - page 1967 / 2589 » Predicting When Not to Predict |
206
click to vote
3DIC
2009
IEEE
16 years 2 months ago
2009
IEEE
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
218
click to vote
ASUNAM
2009
IEEE
16 years 2 months ago
2009
IEEE
In order to understand the evolution of online identities, we measured the correlation between past and current representations of self on the MySpace social network. We applied s...
213
click to vote
CGO
2009
IEEE
16 years 2 months ago
2009
IEEE
Recent work has shown that machine learning can automate and in some cases outperform hand crafted compiler optimizations. Central to such an approach is that machine learning tec...
239
click to vote
CISIS
2009
IEEE
2009
IEEE
Designing Regular Network-on-Chip Topologies under Technology, Architecture and Software Constraints
16 years 2 months ago
—Regular multi-core processors are appearing in the embedded system market as high performance software programmable solutions. The use of regular interconnect fabrics for them a...
200
click to vote
HICSS
2009
IEEE
16 years 2 months ago
2009
IEEE
Deeply embedded infrastructures are pervasive systems that have significant cyber and physical components, interacting with each other in complex ways. These interactions can vio...