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DATE
2010
IEEE
162views Hardware» more  DATE 2010»
15 years 11 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
DSN
2002
IEEE
15 years 11 months ago
Process Modelling to Support Dependability Arguments
This paper reports work to support dependability arguments about the future reliability of a product before there is direct empirical evidence. We develop a method for estimating ...
Robin E. Bloomfield, Sofia Guerra
ISCC
2002
IEEE
111views Communications» more  ISCC 2002»
15 years 11 months ago
How to support Internet-based distribution of video on demand to portable devices
The increasing diffusion of mobile computing and of portable devices with wireless connectivity identifies new challenging scenarios for service provisioning. The access from devi...
Paolo Bellavista, Antonio Corradi
ICA3PP
2010
Springer
15 years 11 months ago
Accelerating Euler Equations Numerical Solver on Graphics Processing Units
Abstract. Finite volume numerical methods have been widely studied, implemented and parallelized on multiprocessor systems or on clusters. Modern graphics processing units (GPU) pr...
Pierre Kestener, Frédéric Chât...
COMPSAC
2009
IEEE
15 years 11 months ago
A Privacy Enhancing Approach for Identity Inference Protection in Location-Based Services
—Recent advances in mobile handheld devices have facilitated the ubiquitous availability of location based services. Systems which provide location based services have always bee...
Chowdhury Sharif Hasan, Sheikh Iqbal Ahamed, Moham...