—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
Abstract Paose (Petri net-based Agent-Oriented Software Engineering) combines the paradigm of AOSE (Agent-Oriented Software Engineering, see [10]) with the expressive power of Petr...
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
Wei Huang, Kevin Skadron, Sudhanva Gurumurthi, Rob...
Set-associative caches are traditionally managed using hardwarebased lookup and replacement schemes that have high energy overheads. Ideally, the caching strategy should be tailor...
Rajiv A. Ravindran, Michael L. Chu, Scott A. Mahlk...
The general purpose processor has long been the focus of intense optimization efforts that have resulted in an impressive doubling of performance every 18 months. However, recent ...
Christopher T. Weaver, Rajeev Krishna, Lisa Wu, To...