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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ECAI
2004
Springer
15 years 11 months ago
IPSS: A Hybrid Reasoner for Planning and Scheduling
In this paper we describe IPSS (Integrated Planning and Scheduling System), a domain independent solver that integrates an AI heuristic planner, that synthesizes courses of actions...
María Dolores Rodríguez-Moreno, Ange...
AI
1998
Springer
15 years 5 months ago
The Logical Foundations of Goal-Regression Planning in Autonomous Agents
This paper addresses the logical foundations of goal-regression planning in autonomous rational agents. It focuses mainly on three problems. The first is that goals and subgoals w...
John L. Pollock
CSCW
2007
ACM
15 years 6 months ago
Supporting Community Emergency Management Planning through a Geocollaboration Software Architecture
Emergency management is more than just events occurring within an emergency situation. It encompasses a variety of persistent activities such as planning, training, assessment, and...
Wendy A. Schafer, Craig H. Ganoe, John M. Carroll
PERCOM
2006
ACM
16 years 5 months ago
Plan B: An Operating System for Ubiquitous Computing Environments
The conventional approach for building pervasive environments relies on middleware to integrate different systems. Instead, we have built a system that can deal with these environ...
Francisco J. Ballesteros, Enrique Soriano, Katia L...