Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
—Success in the software product business requires timely release of new products and upgrades with proper quality and the right features. For this, a systematic approach for man...
— We present a global vector field computation algorithm in configuration spaces for smooth feedback motion planning. Our algorithm performs approximate cell decomposition in t...
— One of the common applications for outdoor robots is to follow a path in large scale unknown environments. This task is challenging due to the intensive memory requirements to ...
Jinhan Lee, Roozbeh Mottaghi, Charles Pippin, Tuck...
— The ability of mobile robots to generate feasible trajectories online is an important requirement for their autonomous operation in unstructured environments. Many path generat...