7825 search results - page 1341 / 1565 » Physics |
157
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ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
200
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ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
Global routing is an important step in the physical design process. In this paper, we propose a new global routing algorithm Archer, which resolves some of the most common problem...
157
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
163
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
High power consumption will shorten battery life for handheld devices and cause thermal and reliability problems. One way to lower the dynamic power consumption is to reduce the s...
154
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
Adaptive body biasing (ABB) is a powerful technique that allows post-silicon tuning of individual manufactured dies such that each die optimally meets the delay and power constrai...