—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Di...
We propose a new countermeasure to protect block ciphers implemented in leaking devices, at the intersection between One-Time Programs and Boolean masking schemes. First, we show t...
Abstract—This paper describes Steptacular, an online interactive incentive system for encouraging people to walk more. A trial offering Steptacular to the employees of Accenture-...
Determinantal point processes (DPPs), which arise in random matrix theory and quantum physics, are natural models for subset selection problems where diversity is preferred. Among...