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205
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GLVLSI
2009
IEEE
15 years 10 months ago
2009
IEEE
The rapidly expanding diversity of technology available at the nanoscale is disrupting the existing transistorcentric microelectronics design paradigm, resulting in nearly decade-l...
167
Voted
ACMACE
2005
ACM
15 years 8 months ago
2005
ACM
Trans-reality games are games that take advantage of pervasive, mobile, ubiquitous, location-based and mixed reality technical infrastructures to create game spaces that can inclu...
159
Voted
ICCAD
2009
IEEE
15 years 4 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
161
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DAC
2009
ACM
16 years 7 months ago
2009
ACM
Metal-only ECO realizes the last-minute design changes by revising the photomasks of metal layers only. This task is challenging because the pre-injected spare cells are limited b...
145
Voted
DAC
2005
ACM
16 years 7 months ago
2005
ACM
Since across-chip interconnect delays can exceed a clock cycle in nanometer technologies, it has become essential in high performance designs to add flip-flops on wires with multi...