Unit testing component-based distributed systems traditionally involved testing functional concerns of the application logic throughout the development lifecycle. In contrast, tes...
James H. Hill, Hamilton A. Turner, James R. Edmond...
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
Jun Yang 0002, Xiuyi Zhou, Marek Chrobak, Youtao Z...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Memory is a scarce resource in many embedded systems. Increasing memory often increases packaging and cooling costs, size, and energy consumption. This paper presents CRAMES, an e...
Lei Yang, Robert P. Dick, Haris Lekatsas, Srimat T...
C applications, in particular those using operating system level services, frequently comprise multiple crosscutting concerns: network protocols and security are typical examples ...