4738 search results - page 876 / 948 » Past, Present, and Future |
160
click to vote
ICWS
2009
IEEE
16 years 3 months ago
2009
IEEE
Advances in the areas of embedded systems, computing, and networking are leading to an infrastructure composed of millions of heterogeneous devices. These devices will not simply ...
163
click to vote
HIPEAC
2010
Springer
16 years 3 months ago
2010
Springer
As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
176
click to vote
ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— As transistor sizes continue to shrink and the number of transistors per chip keeps increasing, chip multiprocessors (CMPs) are becoming a promising alternative to remain on th...
151
click to vote
ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
250
click to vote
TLDI
2010
ACM
16 years 3 months ago
2010
ACM
ML modules are a powerful language mechanism for decomposing programs into reusable components. Unfortunately, they also have a reputation for being “complex” and requiring fa...